The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2024
Filed:
Feb. 28, 2020
Ningbo Sunny Opotech Co., Ltd., Zhejiang, CN;
Mingzhu Wang, Zhejiang, CN;
Takehiko Tanaka, Zhejiang, CN;
Xiaodi Liu, Zhejiang, CN;
Zhen Huang, Zhejiang, CN;
Zhenyu Chen, Zhejiang, CN;
NINGBO SUNNY OPOTECH CO., LTD., Zhejiang, CN;
Abstract
A camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method are provided. The photosensitive assembly includes a photosensitive chip having a photosensitive area and an electric connection area located around the photosensitive area, at least one resistance-capacitance device, a conducting element, an expanded wiring layer, and a molded base. The expanded wiring layer has a top surface and a bottom surface. The at least one resistance-capacitance device is electrically connected to the bottom surface of the expanded wiring layer. The conducting element extends between the bottom surface of the expanded wiring layer and the electric connection area of the photosensitive chip, so as to electrically connect the photosensitive chip to the expanded wiring layer by means of the conducting element. A light hole is formed in the expanded wiring layer, and the light hole corresponds to at least the photosensitive area of the photosensitive chip. The molded base is integrally combined with the photosensitive chip, the at least one resistance-capacitance device, and the expanded wiring layer.