The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2024

Filed:

Mar. 03, 2021
Applicant:

Schott Ag, Mainz, DE;

Inventors:

Andreas Krause, Vilsheim, DE;

Amy Soon Li Ping, Singapore, SG;

Ong Wai Li, Johor Bahru, MY;

Karsten Droegemüller, Eichenau, DE;

Artit Aowudomsuk, Bangkok, TH;

Assignee:

Schott AG, Mainz, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/02315 (2021.01); H01S 5/024 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H01R 12/52 (2011.01);
U.S. Cl.
CPC ...
H01S 5/02315 (2021.01); H01S 5/02415 (2013.01); H05K 1/025 (2013.01); H05K 1/142 (2013.01); H01R 12/52 (2013.01); H05K 2201/09227 (2013.01);
Abstract

A header for an electronic component including a base body, a thermoelectric cooler, a carrier and first and second conductor track arrangements. The thermoelectric cooler is thermally attached to the base body. The carrier is coupled to the thermoelectric cooler and is cooled thereby. The first and second conductor track arrangements each have a signal conductor, at least one grounding conductor and an end. The second conductor track arrangement is on the carrier and connected to the electronic component. The first and second conductor track arrangements are separated by a gap that is bridged by bonding wire connections electrically connecting the first and second signal conductors and electrically connecting the two grounding conductors, the ends facing each other across the gap, at least one of the ends having a capacitive structural feature that increases the capacitance of the first and/or the second conductor track arrangement.


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