The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2024

Filed:

Sep. 16, 2020
Applicant:

Illumina, Inc., San Diego, CA (US);

Inventors:

Arvin Emadi, San Diego, CA (US);

Jon Aday, San Diego, CA (US);

Ali Agah, San Diego, CA (US);

Arnaud Rival, San Diego, CA (US);

Assignee:

Illumina, Inc., San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); G01N 21/64 (2006.01); H01L 21/304 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); G01N 21/6454 (2013.01); H01L 21/304 (2013.01); H01L 21/56 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/97 (2013.01); H01L 2224/02333 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/13008 (2013.01); H01L 2224/13009 (2013.01); H01L 2224/97 (2013.01);
Abstract

Provided herein include various examples of a method for manufacturing aspects of an apparatus, a sensor system. The method may include obtaining a first carrier bonded to an upper surface of the silicon wafer. This wafer includes through silicon vias (TSVs) extended through openings in a passivation stack, with electrical contacts coupled to portions of the TSVs exposed through these openings. The method may include de-bonding the first carrier from the upper surface of the silicon wafer. The method may include dicing the silicon wafer into subsections comprising dies.


Find Patent Forward Citations

Loading…