The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2024

Filed:

Apr. 15, 2022
Applicant:

Shenzhen Guangshe Zhaoming Technology Co., Ltd, Shenzhen, CN;

Inventor:

Jianwei Chen, Shenzhen, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H05K 1/14 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H05K 1/144 (2013.01); H05K 3/368 (2013.01); H01L 24/05 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05686 (2013.01); H01L 2224/05693 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/83862 (2013.01); H01L 2924/0549 (2013.01); H01L 2924/12041 (2013.01);
Abstract

Provided are an insulating paste-based conductive device and a manufacturing method thereof. The device comprises a first substrate and a second substrate arranged relative to the first substrate, and further comprises at least one first electrode disposed below the first substrate, a second electrode disposed on the second substrate and corresponding to the first electrode, and an insulating paste coating disposed on a contact surface between the first electrode and the second electrode, the insulating paste coating being electrically connected with the first electrode and the corresponding second electrode. The invention has good universality, such that the requirements of implementing or applying the art on a ceramic circuit board, a metal-based circuit board, an epoxy glass fiber circuit board, a flexible printed circuit board and a glass circuit board can be set, and an electronic circuit board without a packaging element on the circuit boards above can also be manufactured.


Find Patent Forward Citations

Chen, Jianwei. (2024). Insulating paste-based conductive device and manufacturing method thereof (U.S. Patent No. 12009334). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12009334

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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