The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2024

Filed:

Mar. 16, 2023
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Chiu-Yuan Huang, Miao-Li County, TW;

Pei-Chieh Chen, Miao-Li County, TW;

Yu-Ting Liu, Miao-Li County, TW;

Tsung-Yeh Ho, Miao-Li County, TW;

Assignee:

InnoLux Corporation, Miao-Li County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); G02F 1/1333 (2006.01); H01R 12/70 (2011.01); H01R 12/77 (2011.01); H05K 1/18 (2006.01); H10K 77/10 (2023.01);
U.S. Cl.
CPC ...
H01L 23/4985 (2013.01); G02F 1/133305 (2013.01); H01R 12/7076 (2013.01); H01R 12/77 (2013.01); H05K 1/189 (2013.01); H10K 77/111 (2023.02); H05K 2201/09009 (2013.01); H05K 2201/10128 (2013.01);
Abstract

The present disclosure provides an electronic device including a substrate, an extending element, a conductive element and a first insulating layer. The substrate includes an edge. The extending element is disposed on the substrate and includes a first conductive layer and a semiconductor layer, the first conductive layer and the semiconductor layer are overlapped, and the semiconductor layer extends to the edge of the substrate. The conductive element is overlapped with the first conductive layer. The insulating layer is disposed between the conductive element and the extending element.


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