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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12009277 B1

PDFFull Text
Date of Patent:
Jun. 11, 2024

Filed:

Jul. 18, 2022

Semiconductor package

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Dong Kyu Kim, Anyang-si, KR;

Jung-Ho Park, Cheonan-si, KR;

Jong Youn Kim, Seoul, KR;

Yeon Ho Jang, Goyang-si, KR;

Jae Gwon Jang, Hwaseong-si, KR;

Assignee:

Samsung Electronics Co., Ltd., , KR;

Attorney:

Fish & Richardson P.C.

Primary Examiner:

Thanh Y Tran

Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/4871 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2221/68331 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01);
Abstract

A semiconductor package includes a first semiconductor chip and a second semiconductor chip on a substrate, a barrier layer on the first semiconductor chip and the second semiconductor chip, the barrier layer having an opening through which at least a part of the first semiconductor chip is exposed, and a heat transfer part on the barrier layer, the heat transfer part extending along an upper face of the barrier layer and filling the opening.

Find Patent Forward Citations

Kim, Dong. (2024). Semiconductor package (U.S. Patent No. 12009277). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12009277

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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