The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2024
Filed:
Jul. 21, 2021
Applicant:
Asustek Computer Inc., Taipei, TW;
Inventors:
Hsin-Chen Lin, Taipei, TW;
Ing-Jer Chiou, Taipei, TW;
Assignee:
ASUSTEK COMPUTER INC., Taipei, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); F28D 21/00 (2006.01); H05K 7/20 (2006.01); F28D 9/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3672 (2013.01); H05K 7/20454 (2013.01); F28D 9/0062 (2013.01); F28D 2021/0029 (2013.01); F28F 2255/02 (2013.01); F28F 2280/10 (2013.01);
Abstract
A heat transfer device is provided. The heat transfer device includes a first heat conduction sheet and a second heat conduction sheet. The first heat conduction sheet includes two first rigid parts and a first bendable part connected between the two first rigid parts. The second heat conduction sheet includes two second rigid parts and a second bendable part connected between the two second rigid parts. The two first rigid parts are thermally coupled to the two second rigid parts, respectively. The first bendable portion includes a nonlinear section.