The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2024
Filed:
May. 14, 2019
E.on Sverige Ab, Malmo, SE;
E.ON SVERIGE AB, Malmo, SE;
Abstract
A reversible heat pump assembly () is disclosed. The heat pump assembly () comprises a heat pump () having a first side () and a second side (), the heat pump () being configured to transfer heat from the first side () to the second side () or vice versa; a first side inlet valve assembly () having a heat pump connection () connected to the first side (), and hot and cold conduit connections () arranged to be connected to a thermal energy grid () comprising hot and cold conduits (); a second side outlet valve assembly () having a heat pump connection () connected to the second side (), and heating and cooling circuit connections () arranged to be connected to heating and cooling circuits (), respectively. The reversible heat pump assembly () is configured to be selectively set in either a heating mode or a cooling mode. In the heating mode the heat pump () is configured to transfer heat from the first side () to the second side (), the first side inlet valve assembly () is configured to fluidly connect the hot conduit connection () and the heat pump connection (), and the second side outlet valve assembly () is configured to fluidly connect the heat pump connection () and the heating circuit connection (). In the cooling mode the heat pump () is configured to transfer heat from the second side () to the first side (), the first side inlet valve assembly () is configured to fluidly connect the cold conduit connection () and the heat pump connection (), and the second side outlet valve assembly () is configured to fluidly connect the heat pump connection () and the cooling circuit connection (). Also a district thermal energy distribution system comprising a plurality of reversible heat pump assemblies () is disclosed.