The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2024

Filed:

Dec. 21, 2018
Applicants:

Dow Global Technologies Llc, Midland, MI (US);

Rohm and Haas Company, Collegeville, PA (US);

Inventors:

Rui Shi, Shanghai, CN;

Zhaohui Qu, Shanghai, CN;

Yinzhong Guo, Lake Jackson, TX (US);

Assignees:

Dow Global Technologies LLC, Midland, MI (US);

Rohm and Haas Company, Collegeville, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 41/00 (2006.01); C08G 18/12 (2006.01); C08G 18/40 (2006.01); C08G 18/42 (2006.01); C08G 18/48 (2006.01); C08G 18/76 (2006.01); C09J 175/06 (2006.01); C09J 175/08 (2006.01);
U.S. Cl.
CPC ...
C09J 175/06 (2013.01); C08G 18/12 (2013.01); C08G 18/4018 (2013.01); C08G 18/4238 (2013.01); C08G 18/4825 (2013.01); C08G 18/4829 (2013.01); C08G 18/7671 (2013.01); C09J 175/08 (2013.01); C09J 2301/12 (2020.08); C09J 2301/30 (2020.08); C09J 2400/163 (2013.01); C09J 2423/046 (2013.01); C09J 2475/00 (2013.01);
Abstract

The present disclosure provides a two-component solvent-less adhesive composition. The two-component solvent-less adhesive composition contains the reaction product of (A) an isocyanate component containing the reaction product of (i) an isocyanate monomer and (ii) a first dimer acid polyester polyol; and (B) a polyol component containing (i) a second dimer acid polyester polyol and (ii) optionally, a polyol selected from a polyether polyol, a polyester polyol, and combinations thereof. The two-component solvent-less adhesive composition contains from 15 wt % to 45 wt % units derived from dimer acid, based on the total weight of the two-component solvent-less adhesive composition.


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