The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2024
Filed:
Jan. 17, 2020
Applicant:
Soltrium Advanced Materials Technology, Ltd, Shenzhen, CN;
Inventors:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 11/04 (2006.01); C08K 3/08 (2006.01); C08K 5/5415 (2006.01); C08K 7/00 (2006.01); C08K 9/02 (2006.01); C09J 9/02 (2006.01); C09J 11/06 (2006.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
C09J 11/04 (2013.01); C08K 3/08 (2013.01); C08K 5/5415 (2013.01); C08K 7/00 (2013.01); C08K 9/02 (2013.01); C09J 9/02 (2013.01); C09J 11/06 (2013.01); C09J 163/00 (2013.01); C08K 2003/0806 (2013.01); C08K 2003/085 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01);
Abstract
An epoxy conductive paste is disclosed, based on 100 parts by total mass, comprising the following raw material components: 30˜81 parts of conductive particles, 16˜30 parts of epoxy, 0.2˜3 parts of acrylic, 1˜15 parts of reactive diluent, 1˜15 parts of toughening agent, 0.4˜5 parts of silane coupling agent, and 0.4˜5 parts of cationic curing agent; wherein, the conductive particles include conductive particles with a three-dimensional dendritic microstructure. The conductive paste of the disclosure has the characteristics of good conductivity, short curing time, strong adhesion, and capability for long-term operation at room temperature.