The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2024

Filed:

Oct. 29, 2018
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Se Jin Ku, Daejeon, KR;

Mi Sook Lee, Daejeon, KR;

Na Na Kang, Daejeon, KR;

Eung Chang Lee, Daejeon, KR;

Sung Soo Yoon, Daejeon, KR;

No Jin Park, Daejeon, KR;

Je Gwon Lee, Daejeon, KR;

Eun Young Choi, Daejeon, KR;

Hyung Ju Ryu, Daejeon, KR;

Yoon Hyung Hur, Daejeon, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 230/02 (2006.01); C08F 212/14 (2006.01); C08F 220/30 (2006.01); C08F 220/44 (2006.01); C08F 293/00 (2006.01); C09D 5/00 (2006.01); C09D 133/20 (2006.01); C09D 153/00 (2006.01); H01L 21/027 (2006.01); C08F 220/32 (2006.01);
U.S. Cl.
CPC ...
C08F 212/20 (2020.02); C08F 220/301 (2020.02); C08F 220/44 (2013.01); C08F 293/005 (2013.01); C09D 5/002 (2013.01); C09D 133/20 (2013.01); C09D 153/00 (2013.01); H01L 21/0271 (2013.01); C08F 220/325 (2020.02); C08F 2438/03 (2013.01);
Abstract

The present application relates to a pinning composition, a laminate comprising the same, and a method for producing the same. The pinning composition of the present application can impart directionality and location selection properties to a polymer membrane comprising a self-assembly structure of a block copolymer. The pinning composition of the present application exhibits excellent reaction selectivity, whereby it can form a vertical lamella structure with a high degree of alignment. In addition, the pinning composition of the present application may be suitable for application to low temperature processes.


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