The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2024
Filed:
Dec. 09, 2021
Corning Incorporated, Corning, NY (US);
Fundació Institut DE Ciències Fotòniques (Icfo), Castelldefels, ES;
Institució Catalana DE Recerca I Estudis Avançats, Barcelona, ES;
Therese Francoise Arliguie, Corning, NY (US);
Theresa Chang, Painted Post, NY (US);
Miriam Marchena Martin-Francés, Barcelona, ES;
Prantik Mazumder, Ithaca, NY (US);
Valerio Pruneri, Castelldefels, ES;
Frederic Christian Wagner, Lindley, NY (US);
Corning Incorporated, Corning, NY (US);
Abstract
A method of forming a functionalized device substrate is provided that includes the steps of: forming a conductive layer on a growth substrate; applying a polymeric layer to a device substrate, wherein a coupling agent couples the polymeric layer to the device substrate; coupling the polymeric layer to the conductive layer on the growth substrate; and peeling the growth substrate from the conductive layer.