The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2024
Filed:
Mar. 18, 2021
Microjet Technology Co., Ltd., Hsinchu, TW;
Hao-Jan Mou, Hsinchu, TW;
Rong-Ho Yu, Hsinchu, TW;
Cheng-Ming Chang, Hsinchu, TW;
Hsien-Chung Tai, Hsinchu, TW;
Wen-Hsiung Liao, Hsinchu, TW;
Chi-Feng Huang, Hsinchu, TW;
Yung-Lung Han, Hsinchu, TW;
MICROJET TECHNOLOGY CO., LTD., Hsinchu, TW;
Abstract
The method of the present disclosure includes steps of: (S1) providing a silicon substrate; (S2) arranging and disposing an active component layer by utilizing a first type photomask on at least two high-precision regions of each of a plurality of inkjet print head chip regions on the silicon substrate; (S3) arranging and disposing a passive component layer by utilizing a second type photomask on the active component layer; and (S4) cutting the silicon substrate according to the inkjet print head chip regions so as to form the plurality of narrow type inkjet print head chips.