The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2024

Filed:

Jun. 15, 2022
Applicant:

Samsung E&a Co., Ltd, Seoul, KR;

Inventors:

Ho Sung Na, Hanam, KR;

Dong Hyun Kim, Seoul, KR;

Ju In Park, Seoul, KR;

Hyung Woo In, Seoul, KR;

Hye Jin Ryu, Hanam, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B28B 23/02 (2006.01); B28B 1/00 (2006.01); B28B 3/26 (2006.01); B33Y 30/00 (2015.01);
U.S. Cl.
CPC ...
B28B 23/02 (2013.01); B28B 1/001 (2013.01); B28B 3/2645 (2013.01); B33Y 30/00 (2014.12);
Abstract

The present disclosure relates to a 3D printer for construction for print-molding various structures, in which a main pipefor transferring a filament materialtherein is installed inside a nozzlefor discharging a printing material, such as concrete or mortar, to enable co-printing of the filament materialwith the printing material while embedded in the printing material. According to the present disclosure, in constructing a structure by a 3D printer for construction, a printing material embedded with the filament materialas reinforcing material may be printed, and as a result, the effects of reinforcing tensile strength of the printed object and inhibiting crack of the printed object may be obtained.


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