The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2024

Filed:

Sep. 16, 2021
Applicant:

Medimaging Integrated Solution, Inc., Hsinchu, TW;

Inventors:

Chu-Ming Cheng, Hsinchu, TW;

Shangyi Wu, Hsinchu, TW;

Chia-Jung Lee, Hsinchu, TW;

Chih-Lu Hsu, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 1/05 (2006.01); A61B 1/00 (2006.01); A61B 1/005 (2006.01); A61B 1/06 (2006.01); H01L 27/146 (2006.01); H01L 31/0203 (2014.01); H01L 31/0232 (2014.01); H01L 31/173 (2006.01); A61B 1/018 (2006.01);
U.S. Cl.
CPC ...
A61B 1/051 (2013.01); A61B 1/0011 (2013.01); A61B 1/00124 (2013.01); A61B 1/0057 (2013.01); A61B 1/0676 (2013.01); H01L 27/14618 (2013.01); H01L 31/0203 (2013.01); H01L 31/02325 (2013.01); H01L 31/173 (2013.01); A61B 1/018 (2013.01);
Abstract

A packaged image sensor includes a substrate, an image sensor, a light-emitting element, and a first encapsulant. The substrate includes a through-hole. The image sensor and the light-emitting element are disposed on the substrate and are electrically connected to the substrate. The first encapsulant is filled between the image sensor and the light emitting element, and keeps the through-hole of the substrate opened. The through-hole of the substrate of the above-mentioned packaged image sensor can define a relative position between a pipe and the image sensor to facilitate the subsequent packaging process. An endoscope including the above-mentioned packaged image sensor is also disclosed.


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