The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2024

Filed:

Nov. 26, 2021
Applicant:

Medimaging Integrated Solution, Inc., Hsinchu, TW;

Inventors:

Shangyi Wu, Hsinchu, TW;

Chu-Ming Cheng, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/335 (2011.01); A61B 1/05 (2006.01); G02B 23/24 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
A61B 1/05 (2013.01); G02B 23/2415 (2013.01); G02B 23/2484 (2013.01); H01L 27/14636 (2013.01);
Abstract

An image sensor package includes a first substrate, an image sensor, a second substrate, a light-emitting element, and a first encapsulant. The image sensor is disposed on and electrically connected with the first substrate. The second substrate is disposed on and electrically connected with the first substrate, wherein the second substrate includes an accommodating portion and the image sensor protrudes from the second substrate via the accommodating portion. The light-emitting element is disposed on the second substrate and close to the image sensor, and is electrically connected to the second substrate. The first encapsulant is filled in a space between the image sensor and the light-emitting element. The abovementioned image sensor package can achieve miniaturization and provide better illumination. An endoscope including the abovementioned image sensor package is also disclosed.


Find Patent Forward Citations

Loading…