The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2024
Filed:
Jun. 01, 2022
Applicant:
Samsung Display Co., Ltd., Yongin-si, KR;
Inventor:
Heechul Jeon, Hwaseong-si, KR;
Assignee:
SAMSUNG DISPLAY CO., LTD., Yongin-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 50/84 (2023.01); H01L 25/18 (2023.01); H10K 50/844 (2023.01); H10K 77/10 (2023.01); G02F 1/1333 (2006.01); G06F 1/16 (2006.01); G09G 3/3266 (2016.01); G09G 3/3275 (2016.01); G09G 3/3283 (2016.01); G09G 3/3291 (2016.01); H10K 50/115 (2023.01); H10K 50/842 (2023.01); H10K 59/13 (2023.01); H10K 59/88 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10K 77/111 (2023.02); H01L 25/18 (2013.01); H10K 50/844 (2023.02); G02F 1/133305 (2013.01); G02F 1/133331 (2021.01); G06F 1/1641 (2013.01); G06F 1/1652 (2013.01); G09G 3/3266 (2013.01); G09G 3/3275 (2013.01); G09G 3/3283 (2013.01); G09G 3/3291 (2013.01); G09G 2300/0408 (2013.01); H10K 50/115 (2023.02); H10K 50/84 (2023.02); H10K 50/8426 (2023.02); H10K 59/13 (2023.02); H10K 59/88 (2023.02); H10K 2102/00 (2023.02); H10K 2102/311 (2023.02);
Abstract
A display device includes a substrate including a first region, a second region, and a bending region between the first region and the second region, a protective substrate disposed below the substrate in the first region, the second region, and the bending region, a cushion layer disposed below the protective substrate in the first region and the second region, a pixel layer disposed on the substrate in the second region, and a drive chip disposed on the substrate in the first region. The substrate is bent at the bending region such that the first region overlaps the second region.