The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2024
Filed:
Jun. 14, 2023
Applicant:
Kioxia Corporation, Tokyo, JP;
Inventor:
Takeshi Kamigaichi, Yokkaichi, JP;
Assignee:
KIOXIA CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H10B 43/27 (2023.01); H01L 29/417 (2006.01); H01L 29/423 (2006.01); H10B 41/27 (2023.01); H10B 43/10 (2023.01); H10B 43/30 (2023.01); H10B 43/35 (2023.01);
U.S. Cl.
CPC ...
H10B 43/27 (2023.02); H01L 29/41741 (2013.01); H01L 29/4234 (2013.01); H10B 43/10 (2023.02); H10B 43/30 (2023.02); H10B 43/35 (2023.02); H10B 41/27 (2023.02);
Abstract
A semiconductor body device includes a stacked body including a plurality of electrode layers stacked with an insulator interposed, a semiconductor body extending in a stacking direction of the stacked body through the electrode layers and having a pipe shape, a plurality of memory cells being provided at intersecting portions of the semiconductor body with the electrode layers, and a columnar insulating member extending in the stacking direction inside the semiconductor body having the pipe shape.