The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2024

Filed:

Jul. 01, 2021
Applicants:

Mellanox Technologies, Ltd., Yokneam, IL;

Bar-ilan University, Ramat Gan, IL;

Pcb Technologies Ltd, Migdal Ha'emeq, IL;

Inventors:

Boaz Atias, Maale Adumim, IL;

Elad Mentovich, Tel Aviv, IL;

Yaniv Rotem, Nesher, IL;

Doron Naveh, Petah-Tikva, IL;

Adi Levi, Rosh HaAyin, IL;

Yosi Ben-Naim, Eilat, IL;

Yaad Eliya, Magen Shaul, IL;

Shlomo Danino, Netanya, IL;

Eran Lipp, Hefer, IL;

Assignees:

Mellanox Technologies, Ltd., Yokneam, IL;

BAR-ILAN University, Ramat Gan, IL;

PCB Technologies Ltd, Migdal Ha'emeq, IL;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); B32B 15/14 (2006.01); C01B 32/182 (2017.01); C01B 32/184 (2017.01); C08J 7/043 (2020.01); C08J 7/044 (2020.01); C08J 7/046 (2020.01); C08J 7/06 (2006.01); H01L 21/683 (2006.01); H05K 1/09 (2006.01); H05K 3/38 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4652 (2013.01); C01B 32/184 (2017.08); H05K 3/388 (2013.01); H05K 2203/085 (2013.01); H05K 2203/1338 (2013.01);
Abstract

Processes for laminating a graphene-coated printed circuit board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may include an inner core, an adhesive layer, and at least one graphene-metal structure. Pressure and heat—which may be applied under vacuum or controlled gas atmosphere—may be applied to the lamination stack, after all materials have been placed. The graphene of the graphene-metal structure is designed to promote high frequency performance and heat management within the PCB.


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