The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2024

Filed:

Jun. 09, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Colin Edward Masterson, Rochester, MN (US);

John R. Dangler, Rochester, MN (US);

Tory Johnson, Rochester, MN (US);

Austin Carter, Olmsted, MN (US);

Gunnar Mills, Denver, CO (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/22 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H05K 3/225 (2013.01); H05K 3/064 (2013.01); H05K 3/068 (2013.01); H05K 2203/0126 (2013.01); H05K 2203/0746 (2013.01); H05K 2203/0753 (2013.01); H05K 2203/0766 (2013.01); H05K 2203/175 (2013.01);
Abstract

Embodiments are directed to short and/or near short etch rework. A microfluidic device is positioned on a portion of a circuit having a defect. The microfluidic device is caused to dispense etchant that removes the defect of the circuit, where a flow of the etchant is controlled to access the portion of the circuit having the defect to thereby etch away the defect, the flow of the etchant being obstructed from accessing other portions of the circuit. The microfluidic device is used to extract the etchant from the portion of the circuit such that the etchant avoids contact with the other portions of the circuit. The microfluidic device is removed from the circuit.


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