The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2024

Filed:

Jul. 29, 2019
Applicant:

Kyocera Corporation, Kyoto, JP;

Inventors:

Motohiro Umehara, Yasu, JP;

Kuniaki Mitsuda, Omihachiman, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 3/08 (2006.01); H10N 30/00 (2023.01); H10N 30/072 (2023.01);
U.S. Cl.
CPC ...
H03H 9/02574 (2013.01); H03H 3/08 (2013.01); H03H 9/02559 (2013.01); H10N 30/072 (2023.02); H10N 30/10513 (2023.02);
Abstract

A composite substrate of the present disclosure is a composite substrate comprising a piezoelectric substrate and a sapphire substrate which are directly bonded, wherein the ratio of the number of oxygen atoms to the number of aluminum atoms in the bonding surface region including the bonding surface of the sapphire substrate bonded to the piezoelectric substrate is less than 1.5. The piezoelectric device of the present disclosure comprises the composite substrate. A method for manufacturing the composite substrate of the present disclosure comprises a step of preparing a piezoelectric substrate and a sapphire substrate, a step of heat-treating the sapphire substrate in a reducing atmosphere or in a vacuum, and a step of directly bonding the piezoelectric substrate to the sapphire substrate.


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