The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2024
Filed:
Mar. 19, 2019
Applicant:
Ford Global Technologies, Llc, Dearborn, MI (US);
Inventors:
Linda D. VanFleteren, Troy, MI (US);
James P. Ebling, Ann Arbor, MI (US);
Scott H. Gaboury, Ann Arbor, MI (US);
Assignee:
FORD GLOBAL TECHNOLOGIES, LLC, Dearborn, MI (US);
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); B60R 13/00 (2006.01); H01Q 1/32 (2006.01); H01Q 1/42 (2006.01); H01Q 1/44 (2006.01); B29K 9/06 (2006.01); B29K 33/00 (2006.01); B29K 55/02 (2006.01); B29K 705/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/3233 (2013.01); B60R 13/005 (2013.01); H01Q 1/422 (2013.01); H01Q 1/44 (2013.01); B29C 45/14 (2013.01); B29K 2009/06 (2013.01); B29K 2033/12 (2013.01); B29K 2055/02 (2013.01); B29K 2705/00 (2013.01);
Abstract
A method of forming a badge may include thermally forming an indium film into a desired shape for the badge, including thermally forming a raised symbol above a front surface on the front side of the indium film; molding a plastic back layer to a back side of the thermally formed indium film; and molding a plastic front layer to a front side, opposite to the back side, of the thermally formed indium film. The badge may be mounted on a front of a vehicle.