The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2024

Filed:

Sep. 13, 2021
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Erik G. de Jong, San Francisco, CA (US);

Junlin Mu, Fremont, CA (US);

Sameer Pandya, Sunnyvale, CA (US);

Patrick J. Crowley, San Jose, CA (US);

Antonio F. Herrera, Palo Alto, CA (US);

James G. Horiuchi, Fresno, CA (US);

Sherry Tang, Santa Clara, CA (US);

Mario Martinis, Cupertino, CA (US);

Assignee:

APPLE INC., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 11/02 (2006.01); H01M 10/0525 (2010.01); H01M 10/42 (2006.01); H01M 50/247 (2021.01); H01M 50/284 (2021.01); H01Q 1/24 (2006.01); H01Q 1/27 (2006.01); H01R 12/77 (2011.01); H01R 12/82 (2011.01);
U.S. Cl.
CPC ...
H01Q 1/273 (2013.01); H01M 10/0525 (2013.01); H01M 10/425 (2013.01); H01M 50/247 (2021.01); H01M 50/284 (2021.01); H01Q 1/241 (2013.01); H01R 12/77 (2013.01); H01R 12/82 (2013.01); H01M 2220/30 (2013.01);
Abstract

A portable or wearable electronic device can include a device housing defining an internal volume, and an electronic component disposed in the internal volume. The electronic component can be an input component and can have a component housing. The electronic device can also include an antenna feed assembly disposed in the internal volume. The antenna feed assembly can include a conductive grounding component electrically connected to the component housing and the device housing, and an antenna feed component electrically connected to the grounding component and disposed adjacent to the component housing. The conductive grounding component can surround a first major surface and a second major surface of the component housing.


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