The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2024

Filed:

May. 13, 2021
Applicant:

Quanzhou Sanan Semiconductor Technology Co., Ltd., Fujian, CN;

Inventors:

Junpeng Shi, Fujian, CN;

Qiuxia Lin, Fujian, CN;

Weng-Tack Wong, Fujian, CN;

Changchin Yu, Fujian, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); C09D 127/12 (2006.01); H01L 33/48 (2010.01); H01L 33/56 (2010.01); H01L 33/58 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); C09D 127/12 (2013.01); H01L 33/486 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01);
Abstract

A light-emitting packaging device includes a substrate, a light-emitting diode (LED) chip, an optical element, and a covering member. The LED chip is disposed on the substrate. The optical element is spacedly disposed on the LED chip opposite to the substrate, and has an upper surface and a lower surface that are respectively distal from and proximal to the LED chip. The covering member is made from a fluorine-containing resin, and is configured to cover the LED chip and at least a portion of the upper surface of the optical element.


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