The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2024

Filed:

Dec. 05, 2019
Applicant:

Analog Devices, Inc., Norwood, MA (US);

Inventors:

Vikram Venkatadri, Ayer, MA (US);

Mark Downey, Bolton, MA (US);

Santosh Anil Kudtarkar, Ayer, MA (US);

Assignee:

ANALOG DEVICES, INC., Wilmington, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); G01T 1/24 (2006.01); H01L 23/00 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14661 (2013.01); G01T 1/244 (2013.01); H01L 23/552 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 27/14618 (2013.01); H01L 27/14623 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14659 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/32227 (2013.01); H01L 2924/3025 (2013.01);
Abstract

An integrated device package is disclosed. The integrated device package can include a package substrate having a plurality of contact pads on a first side of the package substrate, the plurality of contact pads configured to electrically connect to a sensor assembly. The package can include a radiation shield attached to a second side of the package substrate by way of a first adhesive, the first side opposite the second side. The package can include an integrated device die attached to the radiation shield by way of a second adhesive. The integrated device die can comprise sensitive active electronic circuitry in a sensitive active region of the integrated device die. A molding compound can be disposed over the integrated device die and the radiation shield.


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