The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2024
Filed:
Nov. 08, 2022
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventor:
Yun Seok Choi, Hwaseong-si, KR;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/48 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/367 (2013.01); H01L 23/481 (2013.01); H01L 23/5383 (2013.01); H01L 23/5385 (2013.01);
Abstract
A semiconductor package includes an upper substrate having a first surface and a second surface which are opposite to each other, a lower semiconductor chip disposed on the first surface of the upper substrate, a plurality of conductive pillars disposed on the first surface of the upper substrate at at least one side of the lower semiconductor chip, and an upper semiconductor chip disposed on the second surface of the upper substrate. The lower semiconductor chip and the plurality of conductive pillars are connected to the first surface of the upper substrate, and the upper semiconductor chip is connected to the second surface of the upper substrate.