logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12002779 B1

PDFFull Text
Date of Patent:
Jun. 04, 2024

Filed:

Mar. 17, 2021

Multilayer body and method of manufacturing the same

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Takashi Iwamoto, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

David A Zarneke

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01); H03H 3/08 (2006.01); H03H 9/05 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/5389 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 24/03 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/06155 (2013.01); H01L 2224/14155 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/17055 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06555 (2013.01); H03H 3/08 (2013.01); H03H 9/0557 (2013.01); H03H 9/059 (2013.01);
Abstract

A multilayer body includes a first electronic component and a structural body including first and second regions. The first electronic component is in the second region. The multilayer body includes a second electronic component mounted via a solder bump onto the structural body with a connection pad interposed therebetween. An outer surface of the first region and an outer surface of the first electronic component have a step difference therebetween in a height direction of the structural body. The connection pad is on the outer surface of the first region, an outer surface of the first electronic component, and a step-difference surface of a portion of the step difference.

Find Patent Forward Citations

Loading…