The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2024

Filed:

Mar. 18, 2022
Applicant:

Nanya Technology Corporation, New Taipei, TW;

Inventor:

Teng-Yen Huang, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 25/0657 (2013.01); H01L 24/02 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/03001 (2013.01); H01L 2224/03011 (2013.01); H01L 2224/03452 (2013.01); H01L 2224/0361 (2013.01); H01L 2224/03622 (2013.01); H01L 2224/05018 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05181 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/05186 (2013.01); H01L 2224/05193 (2013.01); H01L 2224/05546 (2013.01); H01L 2224/05559 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05657 (2013.01); H01L 2224/05676 (2013.01); H01L 2224/0568 (2013.01); H01L 2224/05684 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06051 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/06517 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/08146 (2013.01); H01L 2224/80379 (2013.01); H01L 2924/04941 (2013.01); H01L 2924/04953 (2013.01); H01L 2924/0496 (2013.01); H01L 2924/0504 (2013.01); H01L 2924/0509 (2013.01); H01L 2924/0544 (2013.01); H01L 2924/059 (2013.01); H01L 2924/30105 (2013.01);
Abstract

The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a first semiconductor structure and a first connecting structure, wherein the first connecting structure includes a first connecting insulating layer positioned on the first semiconductor structure, two first conductive layers positioned in the first connecting insulating layer, and a first porous layer positioned between the two first conductive layers. A porosity of the first porous layer is between about 25% and about 100%. The first semiconductor structure includes a plurality of first composite conductive features, wherein at least one of the plurality of first composite conductive features includes a first protection liner, a first graphene liner in the first protection liner and a first core conductor in the first graphene liner.


Find Patent Forward Citations

Huang, Teng-Yen. (2024). Semiconductor device with composite conductive features and method for fabricating the same (U.S. Patent No. 12002772). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12002772

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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