The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2024

Filed:

Mar. 22, 2019
Applicant:

Siemens Industry Software Inc., Plano, TX (US);

Inventors:

Gaurav Veda, Hillsboro, OR (US);

Wu-Tung Cheng, Lake Oswego, OR (US);

Manish Sharma, Wilsonville, OR (US);

Huaxing Tang, Wilsonville, OR (US);

Yue Tian, Wilsonville, OR (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06N 7/01 (2023.01); G06F 30/367 (2020.01); G06N 20/00 (2019.01);
U.S. Cl.
CPC ...
G06N 7/01 (2023.01); G06F 30/367 (2020.01); G06N 20/00 (2019.01);
Abstract

A computing system may include a model training engine configured to train a supervised learning model with a training set comprising training probability distributions computed for training dies through a local phase of a volume diagnosis procedure. The computing system may also include a volume diagnosis adjustment engine configured to access a diagnosis report for a given circuit die that has failed scan testing and compute, through the local phase of the volume diagnosis procedure, a probability distribution for the given circuit die from the diagnosis report. The volume diagnosis adjustment engine may also adjust the probability distribution into an adjusted probability distribution using the supervised learning model and provide the adjusted probability distribution for the given circuit die as an input to a global phase of the volume diagnosis procedure to determine a global root cause distribution for multiple circuit dies that have failed the scan testing.


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