The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2024

Filed:

Jun. 12, 2019
Applicant:

Tyco Fire & Security Gmbh, Neuhausen am Rheinfall, CH;

Inventors:

Gustavo Leon, Tamarac, FL (US);

Stewart E. Hall, Wellington, FL (US);

Craig Trivelpiece, Mission Viejo, CA (US);

Paul B. Rasband, Fremont, CA (US);

Assignee:

Tyco Fire & Security GmbH, Neuhausen am Rheinfall, CH;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 9/4401 (2018.01); A61B 17/00 (2006.01); G01S 5/02 (2010.01); G01S 13/76 (2006.01); G01S 13/87 (2006.01); G06F 8/61 (2018.01); G08B 7/06 (2006.01); G08B 13/196 (2006.01); G08B 25/00 (2006.01); G08B 29/18 (2006.01); H04L 9/00 (2022.01); H04L 12/46 (2006.01); H04L 12/64 (2006.01); H04L 43/0876 (2022.01); H04L 61/106 (2022.01); H04L 67/00 (2022.01); H04L 67/104 (2022.01); H04L 67/12 (2022.01); H04N 5/76 (2006.01); H04N 23/65 (2023.01); H04W 8/26 (2009.01); H04W 16/26 (2009.01); H04W 24/02 (2009.01); H04W 88/04 (2009.01); H04L 43/0805 (2022.01); H04L 61/59 (2022.01); H04L 67/1087 (2022.01); H04L 101/672 (2022.01); H04W 4/38 (2018.01); H04W 84/18 (2009.01); H04W 92/02 (2009.01);
U.S. Cl.
CPC ...
G06F 9/4416 (2013.01); A61B 17/00 (2013.01); G01S 5/0236 (2013.01); G01S 5/0284 (2013.01); G01S 13/765 (2013.01); G01S 13/876 (2013.01); G06F 8/63 (2013.01); G08B 7/062 (2013.01); G08B 7/066 (2013.01); G08B 13/19613 (2013.01); G08B 13/19634 (2013.01); G08B 13/19697 (2013.01); G08B 25/009 (2013.01); G08B 29/181 (2013.01); G08B 29/188 (2013.01); H04L 9/004 (2013.01); H04L 12/4625 (2013.01); H04L 12/6418 (2013.01); H04L 43/0876 (2013.01); H04L 61/106 (2013.01); H04L 67/104 (2013.01); H04L 67/12 (2013.01); H04L 67/34 (2013.01); H04N 5/76 (2013.01); H04N 23/65 (2023.01); H04W 8/26 (2013.01); H04W 16/26 (2013.01); H04W 24/02 (2013.01); H04W 88/04 (2013.01); G08B 13/19608 (2013.01); G08B 13/19671 (2013.01); G08B 25/007 (2013.01); H04L 43/0805 (2013.01); H04L 61/59 (2022.05); H04L 67/1051 (2013.01); H04L 67/1093 (2013.01); H04L 2101/672 (2022.05); H04W 4/38 (2018.02); H04W 84/18 (2013.01); H04W 92/02 (2013.01); Y04S 40/00 (2013.01); Y04S 40/18 (2018.05);
Abstract

A distributed device network including a number of device nodes connected to a wireless mesh network and including memory configured to store instructions thereon. The instructions cause the one or more processors to receive, from a server by a first device node of the number of device nodes, a first packaged application, the first packaged application including a first functionality, execute, by the first device node, the first packaged application to provide the first functionality receive, from the server by a second device node of the number of device nodes, a second packaged application, the second packaged application including a second functionality, execute, by the second device node, the second packaged application to provide the second functionality, wherein the number of device nodes are resource-constrained devices that cooperate to perform one or more functions of a cloud computing system.


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