The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2024
Filed:
Feb. 22, 2022
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Masayasu Sakuma, Shiojiri, JP;
Assignee:
SEIKO EPSON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P 15/08 (2006.01); B81B 7/00 (2006.01); G01P 1/02 (2006.01); G01P 3/00 (2006.01); G01P 15/18 (2013.01);
U.S. Cl.
CPC ...
G01P 15/08 (2013.01); B81B 7/007 (2013.01); G01P 1/023 (2013.01); G01P 3/00 (2013.01); G01P 15/0802 (2013.01); G01P 15/18 (2013.01); B81B 2201/0228 (2013.01); B81B 2207/012 (2013.01);
Abstract
A sensor module includes: a substrate including a first terminal and a second terminal; a first conductive bonding member having a first melting point and a first Young's modulus; a lead bonded to the first terminal by the first conductive bonding member; a second conductive bonding member having a second melting point lower than the first melting point and a second Young's modulus higher than the first Young's modulus; and an inertial sensor bonded to the second terminal by the second conductive bonding member.