The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2024

Filed:

Jul. 12, 2022
Applicant:

Fabric8labs, Inc., San Diego, CA (US);

Inventors:

David Pain, Carlsbad, CA (US);

Andrew Edmonds, Oceanside, CA (US);

Jeffrey Herman, Solana Beach, CA (US);

Charles Pateros, Carlsbad, CA (US);

Kareemullah Shaik, San Diego, CA (US);

Edward White, San Diego, CA (US);

Assignee:

FABRIC8LABS, INC., San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/04 (2006.01); B33Y 30/00 (2015.01); C23C 14/04 (2006.01); C23C 14/08 (2006.01); C23C 14/14 (2006.01); C23C 16/27 (2006.01); C25D 5/10 (2006.01); C25D 17/00 (2006.01); B29C 64/112 (2017.01); B29C 64/209 (2017.01);
U.S. Cl.
CPC ...
C23C 16/042 (2013.01); B33Y 30/00 (2014.12); C23C 14/042 (2013.01); C23C 14/08 (2013.01); C23C 14/14 (2013.01); C23C 16/278 (2013.01); C25D 5/10 (2013.01); C25D 17/00 (2013.01); B29C 64/112 (2017.08); B29C 64/209 (2017.08);
Abstract

Process for manufacturing a printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.


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