The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2024

Filed:

Jun. 13, 2022
Applicant:

Liquid X Printed Metals, Inc., Pittsburgh, PA (US);

Inventor:

Robert Swisher, Pittsburgh, PA (US);

Assignee:

LIQUID X PRINTED METALS, INC., Pittsburgh, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09D 11/52 (2014.01); B41M 3/00 (2006.01); B41M 5/00 (2006.01); C09D 11/033 (2014.01); C09D 11/037 (2014.01); C09D 11/32 (2014.01); C09D 11/322 (2014.01); C09D 11/36 (2014.01); C09D 11/38 (2014.01); G01L 1/18 (2006.01); G01L 5/22 (2006.01); H05B 1/02 (2006.01); H05B 3/03 (2006.01); H05B 3/12 (2006.01); H05B 3/34 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
C09D 11/52 (2013.01); B41M 3/006 (2013.01); B41M 5/0023 (2013.01); B41M 5/0047 (2013.01); C09D 11/033 (2013.01); C09D 11/037 (2013.01); C09D 11/32 (2013.01); C09D 11/322 (2013.01); C09D 11/36 (2013.01); C09D 11/38 (2013.01); G01L 1/18 (2013.01); G01L 5/22 (2013.01); H05B 1/0213 (2013.01); H05B 1/0238 (2013.01); H05B 3/03 (2013.01); H05B 3/12 (2013.01); H05B 3/34 (2013.01); H05K 1/032 (2013.01); H05K 1/038 (2013.01); H05K 1/0393 (2013.01); H05K 1/092 (2013.01); H05K 3/125 (2013.01); H05B 2203/013 (2013.01); H05B 2203/029 (2013.01); H05B 2214/02 (2013.01); H05K 2203/11 (2013.01);
Abstract

Described herein are molecular inks, methods for printing the molecular inks on flexible substrates, and methods for forming printed electronic elements, such as resistive heaters, force sensors, motion sensors, and devices that include these elements, such as force responsive conductive heaters. The methods include printing a molecular ink on a flexible substrate that is heated to 30° C. to 90° C. before and/or during the printing process and curing the substrate to produce a conductive pattern thereon. The molecular inks generally include a particle-fee metal-complex composition formulated from at least one metal complex and a solvent, and optionally, a conductive filler material, and/or surfactant.


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