The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2024
Filed:
Jul. 06, 2022
Hyundai Motor Company, Seoul, KR;
Kia Corporation, Seoul, KR;
Gs Caltex Corporation, Seoul, KR;
Jin Young Yoon, Gimpo-si, KR;
Hee Joon Lee, Seoul, KR;
Dong Eun Cha, Hwaseong-si, KR;
Sun Jun Kwon, Seoul, KR;
Chun Ho Park, Seoul, KR;
Seung Ryong Jeong, Seoul, KR;
Seok Jin Yong, Daejeon, KR;
Hyung Tak Lee, Daejeon, KR;
Abstract
The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. The thermoplastic resin composition includes a first propylene-ethylene copolymer, a second propylene-ethylene copolymer, a thermoplastic elastomer, an inorganic filler, and a sodium-phosphate-based nucleating agent as appropriate, and thus a molded article produced therefrom can exhibit improved mechanical rigidity, impact resistance, and dimensional stability. Even when formed to a low thickness for weight reduction, the molded article can be imparted with excellent processability, high tensile strength, a high flexural modulus, and high impact strength.