The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2024
Filed:
Jun. 11, 2021
Hrl Laboratories, Llc, Malibu, CA (US);
Ashley Dustin, Los Angeles, CA (US);
Adam Gross, Santa Monica, CA (US);
Andrew Nowak, Los Angeles, CA (US);
Kaitlin Albanese, Santa Barbara, CA (US);
HRL Laboratories, LLC, Malibu, CA (US);
Abstract
Some variations provide a thermoformable and thermosettable bismaleimide-thiol-epoxy resin composition comprising: a thiol-endcapped bismaleimide monomer or oligomer; a thiol-containing species; an epoxy species; a curing catalyst; and optional additives. Other variations provide a method of making a bismaleimide-thiol-epoxy resin composition, comprising: providing a starting bismaleimide, a starting multifunctional amine, a starting multifunctional thiol, an acid catalyst, and a solvent to form a starting reaction mixture; reacting the bismaleimide, the multifunctional amine, and the multifunctional thiol to form a thiol-endcapped bismaleimide monomer or oligomer; providing a thiol-containing species; providing at least one epoxy species; providing a curing catalyst; and combining the thiol-endcapped bismaleimide monomer or oligomer, the thiol-containing species, the epoxy species, and the curing catalyst, to form a bismaleimide-thiol-epoxy resin composition. Other variations provide a method of thermoprocessing comprising: thermoforming, but not completely curing, a bismaleimide-thiol-epoxy resin composition; and, at a later time, completely curing the thermoformed bismaleimide-thiol-epoxy resin.