The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2024

Filed:

May. 26, 2020
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Kevin W. Gotrik, Hudson, WI (US);

Scott J. Jones, Woodbury, MN (US);

Huiwen Tai, Lake Elmo, MN (US);

Joan M. Frankel, Woodbury, MN (US);

Robert R. Owings, Woodbury, MN (US);

Bhaskar V. Velamakanni, Woodbury, MN (US);

Jeanne M. Bruss, Cottage Grove, MN (US);

David J. Rowe, Roseville, MN (US);

Matthew E. Sousa, Rosemount, MN (US);

Bradley L. Givot, St. Paul, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/17 (2006.01); C23C 14/58 (2006.01);
U.S. Cl.
CPC ...
B44C 1/1708 (2013.01); C23C 14/5886 (2013.01);
Abstract

A transfer article with a thickness of less than 3 micrometers includes a first acrylate layer that is releasable from a metal or doped semiconductor release layer at a release value of from 2 to 50 grams/inch. The article includes a functional layer overlaying the first acrylate layer. The functional layer includes at least one microfractured inorganic layer about 3 nanometers to about 200 nanometers thick, which has a plurality of toolmarks interspersed with cracks.


Find Patent Forward Citations

Loading…