The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2024

Filed:

Dec. 23, 2021
Applicant:

Brother Kogyo Kabushiki Kaisha, Nagoya, JP;

Inventors:

Yuki Naruse, Toyoake, JP;

Keisuke Nishihara, Nagoya, JP;

Akira Minami, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/32 (2006.01); B41J 3/407 (2006.01); B41J 11/00 (2006.01); B65C 9/18 (2006.01); B65C 11/02 (2006.01);
U.S. Cl.
CPC ...
B41J 2/32 (2013.01); B41J 3/4075 (2013.01); B41J 11/002 (2013.01); B65C 9/1803 (2013.01); B65C 9/1865 (2013.01); B65C 11/0215 (2013.01); B65C 2210/0018 (2013.01);
Abstract

A medium includes: a heat-sensitive medium subjected to thermal printing; and an adhesive medium to be superimposed on the heat-sensitive medium in a thickness direction and bonded to the heat-sensitive medium. The heat-sensitive medium includes: a surface contacting the adhesive medium; a heat-sensitive medium base material having a transparency; and a first color producing layer having a transparency. The heat-sensitive medium base material has an uneven shape having roughness greater than that of the surface of the heat-sensitive medium. The first color producing layer is configured to produce a first color when heated to a temperature higher than or equal to a first temperature. The adhesive medium includes: an adhesive medium base material; and an adhesive layer provided on the adhesive medium base material. The adhesive layer makes contact with the surface of the heat-sensitive medium so that the adhesive medium is bonded to the heat-sensitive medium.


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