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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11999089 B1

PDFFull Text
Date of Patent:
Jun. 04, 2024

Filed:

Oct. 19, 2021

Transportable molding system for forming insulation on long pipes and related methods

Applicant:

Bayou Holdco, Inc., Houston, TX (US);

Inventor:

Randall Perkins, Houston, TX (US);

Assignee:

Bayou HoldCo, Inc., Houston, TX (US);

Attorney:

Stinson LLP

Primary Examiner:

Benjamin A Schiffman

Int. Cl.
CPC ...
B29C 45/14 (2006.01); B29C 33/02 (2006.01); B29C 33/26 (2006.01); B29C 33/28 (2006.01); B29C 33/30 (2006.01); B29C 33/34 (2006.01); B29C 45/26 (2006.01); B29C 45/34 (2006.01); B29C 45/80 (2006.01); B29L 23/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14622 (2013.01); B29C 33/02 (2013.01); B29C 33/26 (2013.01); B29C 33/28 (2013.01); B29C 33/302 (2013.01); B29C 33/303 (2013.01); B29C 33/34 (2013.01); B29C 45/14598 (2013.01); B29C 45/261 (2013.01); B29C 45/34 (2013.01); B29C 45/80 (2013.01); B29K 2995/0015 (2013.01); B29L 2023/225 (2013.01);
Abstract

A portable molding system is configured for forming insulation on pipes. A set of transportable process modules are configured to be shipped to a molding site, operatively connected together at the molding site to form a site-installed molding system, and subsequently disconnected for transport to another site. The set of transportable process modules includes one or more resin preparation modules configured to prepare resin for being formed into insulation on the pipes. One or more mold modules are configured to define a mold cavity. The one or more mold modules are configured to hold a pipe in the mold cavity, to receive resin prepared by the one or more resin preparation modules in the mold cavity around the pipe, and to form said resin received in the mold cavity into insulation on the pipe.

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