The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2024

Filed:

May. 14, 2021
Applicant:

Pink Gmbh Thermosysteme, Wertheim, DE;

Inventors:

Thomas Krebs, Wertheim, DE;

Christoph Oetzel, Freudenberg-Boxtal, DE;

Assignee:

PINK GMBH THERMOSYSTEME, Wertheim, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 3/08 (2006.01); B23K 35/38 (2006.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0016 (2013.01); B23K 3/085 (2013.01); B23K 35/383 (2013.01); B23K 2101/36 (2018.08);
Abstract

A system for connecting electronic assemblies, in particular a soldering and/or sintering system, has a transport device for conveying the assemblies through the system, with a plurality of gas-tightly separable modules for connecting the assemblies to one another. At least one module is a soldering and/or sintering module and one module is a cooling module. Between the soldering/sintering and the cooling module, a further module is a soft cooling module for cooling between a process temperature of the soldering or sintering module and an intermediate temperature, in particular below a solder solidification temperature. In a soldering or sintering module in a gas-tightly sealable process chamber, in particular in the soft cooling module, at least one heat source is contactable with the assemblies for heating the assemblies and at least one cold trap is arranged, having in operation a surface temperature which is lower than a heat source operating temperature.


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