The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2024

Filed:

Dec. 12, 2019
Applicant:

Sumitomo Electric Hardmetal Corp., Itami, JP;

Inventors:

Susumu Okuno, Itami, JP;

Shinya Imamura, Itami, JP;

Yuki Rikiso, Itami, JP;

Yasuki Kido, Itami, JP;

Fumiyoshi Kobayashi, Itami, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/14 (2006.01); B23B 27/14 (2006.01); B23C 5/16 (2006.01); C23C 16/34 (2006.01); C23C 16/36 (2006.01); C23C 16/40 (2006.01); C23C 28/04 (2006.01);
U.S. Cl.
CPC ...
B23B 27/148 (2013.01); B23C 5/16 (2013.01); C23C 16/34 (2013.01); C23C 16/36 (2013.01); C23C 16/403 (2013.01); C23C 28/044 (2013.01); B23B 2224/04 (2013.01); B23B 2224/32 (2013.01); B23B 2224/36 (2013.01);
Abstract

A cutting tool comprises a substrate and a coating that coats the substrate, the coating including an α-alumina layer provided on the substrate, the α-alumina layer including crystal grains of α-alumina, the α-alumina layer including a lower portion and an upper portion, the upper portion being occupied in area at a ratio of 50% or more by crystal grains of α-alumina having a (006) plane with a normal thereto having a direction within ±15° with respect to a direction of the normal to the second interface, the lower portion being occupied in area at a ratio of 50% or more by crystal grains of α-alumina having a (110) plane with a normal thereto having a direction within ±15° with respect to the direction of the normal to the second interface, the α-alumina layer having a thickness of 3 μm or more and 20 μm or less.


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