The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2024

Filed:

Apr. 01, 2019
Applicant:

Masten Space Systems, Inc., Mojave, CA (US);

Inventors:

Matthew Kuhns, Mojave, CA (US);

Jacob S. Nuechterlein, Erie, CO (US);

Jeremy Joseph Iten, Erie, CO (US);

Adam Polizzi, Erie, CO (US);

Assignee:

ASTROBOTIC TECHNOLOGY, INC., Pittsburgh, PA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B22F 3/11 (2006.01); B22F 7/00 (2006.01); B22F 10/28 (2021.01); B22F 10/34 (2021.01); B22F 10/38 (2021.01); B22F 10/80 (2021.01); B23K 26/082 (2014.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B22F 10/32 (2021.01); B22F 10/366 (2021.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B22F 3/11 (2013.01); B22F 7/002 (2013.01); B22F 10/28 (2021.01); B22F 10/34 (2021.01); B22F 10/38 (2021.01); B22F 10/80 (2021.01); B23K 26/082 (2015.10); B33Y 70/00 (2014.12); B22F 10/32 (2021.01); B22F 10/366 (2021.01); B22F 2998/10 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12);
Abstract

An additively manufactured non-uniform porous material in-situ with dense material for the in situ additive manufacturing of both porous and dense material in the same part so that no secondary process is required. The additively manufactured non-uniform porous material in-situ with dense material generally includes additively manufactured porous material which can be tuned for porosity and density, has the ability to be built in situ with dense material, and can also be tuned for response to pressure waves. Also included are computer program products, methods and components and systems manufactured using the methods.


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