The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2024

Filed:

Dec. 08, 2021
Applicant:

Ciena Corporation, Hanover, MD (US);

Inventors:

Mitchell O'Leary, Ottawa, CA;

Bonnie L. Mack, Carp, CA;

Trevor Meunier, Kemptville, CA;

Assignee:

Ciena Corporation, Hanover, MD (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 7/142 (2013.01); H05K 7/1427 (2013.01);
Abstract

A sprung frame assembly that can accommodate varying tolerance device heights while still exerting sufficient pressure/force required to a heatsink to contact and cool a bare die device, or other device of the like. Adapted for space constrained modules where placement of mounting holes is limited, and module density is high. Sprung frames are secured to mounting points at available locations on support structures as to eliminate any mounting holes in the PCB. The required force/pressure can be evenly achieved by methodically tightening a plurality of screws with springs at the corners of the sprung frames in sequence, pressure is applied evenly without damaging the device, while also taking up any tolerances in the device height.


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