The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2024

Filed:

May. 10, 2022
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Woo Seok Yang, Suwon-si, KR;

Jae Han Park, Suwon-si, KR;

Jung Hyun Cho, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4697 (2013.01); H05K 1/115 (2013.01); H05K 1/185 (2013.01); H05K 3/4602 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/09136 (2013.01);
Abstract

A printed circuit board includes: a core portion including a cavity in one surface thereof; first and second penetration holes disposed in a bottom surface of the cavity and penetrating through the core portion; an electronic component disposed in the cavity; and an insulating material filling the cavity and each of the first and second penetration holes, wherein a sidewall of the cavity is higher than the electronic component.


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