The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2024

Filed:

Oct. 24, 2022
Applicant:

Translarity, Inc., Fremont, CA (US);

Inventors:

Dominik Schmidt, Fremont, CA (US);

Prasanna Rao Chitturi, Fremont, CA (US);

Jed Hsu, Fremont, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); G01R 1/04 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/04 (2006.01); H05K 3/42 (2006.01); H05K 3/24 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 1/116 (2013.01); G01R 1/0441 (2013.01); H05K 1/0266 (2013.01); H05K 1/111 (2013.01); H05K 3/0029 (2013.01); H05K 3/0032 (2013.01); H05K 3/045 (2013.01); H05K 3/423 (2013.01); H05K 3/244 (2013.01); H05K 3/368 (2013.01); H05K 2201/094 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/09672 (2013.01); H05K 2203/025 (2013.01); H05K 2203/0353 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/0766 (2013.01); H05K 2203/095 (2013.01);
Abstract

A single-layer redistribution plate functioning as a space translator between a device under testing ('DUT') and a testing PCB may comprise a hard ceramic plate. A DUT side of the plate may have pads configured to interface with a device under testing. Both sides of the plate may comprise traces, vias, and pads to fan out the DUT pad pattern so that the plate side opposite the DUT side has spatially translated pads configured to interface with the pads on a testing PCB. Fabricating a redistribution plate may comprise calibrating and aligning, laser milling vias, laser milling trenches and pads, copper plating, grinding and polishing, removing residual copper, and coating the copper surfaces.


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