The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2024
Filed:
Jan. 14, 2020
Applicant:
Tyco Electronics Raychem Gmbh, Ottobrunn, DE;
Inventors:
Thilo Simonsohn, Munich, DE;
Christian Heindl, Munich, DE;
Assignee:
TYCO ELECTRONICS RAYCHEM GMBH, Ottobrunn, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 63/42 (2006.01); B29C 61/06 (2006.01); B29C 65/34 (2006.01); F16L 47/22 (2006.01); H02G 15/18 (2006.01);
U.S. Cl.
CPC ...
H02G 15/1806 (2013.01); B29C 61/0616 (2013.01); B29C 65/342 (2013.01); F16L 47/22 (2013.01); B29C 63/42 (2013.01);
Abstract
A heat shrink component includes a heat shrink layer and a heating unit in thermal contact with at least a part of the heat shrink layer and heating the heat shrink layer to a heat shrink temperature. The heating unit includes an electrically conductive lead formed of copper and/or aluminum and having an electrical conductivity of more than 3·10S/m. The heat shrink component has a first dimension in an expanded state and a second dimension in a shrunk state after heating. The first dimension is larger than the second dimension.