The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2024

Filed:

Mar. 20, 2020
Applicant:

J-mex Inc., Hsinchu, TW;

Inventors:

Chun-Yuan Huang, Hsinchu, TW;

Wei-Chun Hsueh, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 33/92 (2006.01); A61B 5/00 (2006.01); A61B 5/11 (2006.01); A61B 5/251 (2021.01); A61B 5/256 (2021.01); A61B 5/257 (2021.01); A61H 1/02 (2006.01);
U.S. Cl.
CPC ...
H01R 33/92 (2013.01); A61B 5/11 (2013.01); A61B 5/1114 (2013.01); A61B 5/251 (2021.01); A61B 5/256 (2021.01); A61B 5/257 (2021.01); A61B 5/6804 (2013.01); A61B 5/6824 (2013.01); A61B 2560/0443 (2013.01); A61H 1/0274 (2013.01);
Abstract

A bonding device for a wearable device includes a first bonding structure and a second bonding structure. The first bonding structure includes a first wire connecting member, a first bonding member and an elastic member, and has a plurality of first mechanical structures configured to form a first mechanical bond and a plurality of first electrical contacts configured to form a first electrical bond, and the second bonding structure includes a first signal connecting line, wherein the first wire connecting member, the first bonding member, and the elastic member form the first mechanical bond through the plurality of first mechanical structures; the first wire connecting member, the first bonding member, and the elastic member form the first electrical bond through the plurality of first electrical contacts; and the elastic member is electrically connected to the first signal connecting line to combine the first bonding structure and the second bonding structure.


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