The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2024

Filed:

Nov. 13, 2020
Applicant:

Sanyo Electric Co., Ltd., Kadoma, JP;

Inventors:

Fumiya Matsushita, Osaka, JP;

Shota Matsubara, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 50/503 (2021.01); H01M 50/519 (2021.01); H01M 50/522 (2021.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01M 50/519 (2021.01); H01M 50/503 (2021.01); H01M 50/522 (2021.01); H05K 1/02 (2013.01); H05K 2201/09063 (2013.01);
Abstract

A circuit board soldering structure includes lead a plate inserted into a slit hole of a circuit board and soldered to a conductive pattern provided along the slit hole. The lead plate is made of an elastically-deformable metal plate thinner than an opening width (W) of slit hole. The lead plate includes insertion section inserted into the slit hole. The insertion section includes a bent section approaching from one of opposing inner surfaces of the slit hole facing each other toward another of the opposing inner surfaces of the slit hole. The bent section is disposed in the slit hole. The insertion section has both surfaces that are close to or contact corresponding opposing inner surfaces of the slit hole to solder the insertion section to the conductive pattern.


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