The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2024

Filed:

Nov. 27, 2019
Applicant:

Ams Sensors Singapore Pte. Ltd., Singapore, SG;

Inventors:

Ji Wang, Singapore, SG;

Kam Wah Leong, Singapore, SG;

QiChuan Yu, Singapore, SG;

Simon Gubser, Weesen, CH;

Yoong Kheng Teoh, Singapore, SG;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/34 (2006.01); B29C 33/12 (2006.01); B29C 70/88 (2006.01); B29C 71/02 (2006.01); B29C 71/04 (2006.01); B29D 11/00 (2006.01); H01L 25/16 (2023.01); H01L 33/56 (2010.01); B29C 45/00 (2006.01); B29C 45/14 (2006.01); B29K 63/00 (2006.01); B29L 31/34 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); B29C 33/12 (2013.01); B29D 11/00307 (2013.01); B29D 11/00807 (2013.01); H01L 25/167 (2013.01); B29C 2045/0075 (2013.01); B29C 45/14065 (2013.01); B29C 2045/14114 (2013.01); B29C 45/14639 (2013.01); B29C 2791/006 (2013.01); B29K 2063/00 (2013.01); B29L 2031/34 (2013.01); B29L 2031/3425 (2013.01); H01L 2933/005 (2013.01); H05K 3/284 (2013.01);
Abstract

Manufacturing optoelectronic modules includes supporting a printed circuit board substrate () on a first vacuum injection tool (). The printed circuit board substrate () has at least one optoelectronic component mounted thereon and has a solder mask () on a surface () facing away from the first vacuum injection tool (). The method includes causing the first vacuum injection tool () and a second vacuum injection tool () to be brought closer to one another such that a surface () of the second vacuum injection tool () is in contact with the solder mask (). Subsequently, a first epoxy () is provided, using a vacuum injection technique, in spaces () between the upper tool () and the solder mask ().


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