The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2024

Filed:

Sep. 04, 2020
Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Bongchu Shim, Seoul, KR;

Hyunwoo Cho, Seoul, KR;

Assignee:

LG ELECTRONICS INC., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 21/67 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 21/67253 (2013.01); H01L 33/005 (2013.01);
Abstract

The embodiment relates to an intelligent integrated assembly and transfer apparatus. The intelligent integrated assembly and transfer apparatus according to the embodiment can include a fluid chamber, a roller unitand assembly inspection unit. The fluid chambercan accommodate semiconductor light emitting devices. Semiconductor light emitting devicescan be assembled on an assembly substrate. The assembly substratecan be mounted on the roller unit. The roller unitcan rotate the assembly substrate. The assembly inspection unitcan inspect the semiconductor light emitting devicesassembled on the assembly substrate. The roller unitcan include a roller rotated partwhere the assembly substrateis mounted and rotated, a roller driving partfor rotating the roller rotated part, and a magnet head unitfor applying magnetic force to the semiconductor light emitting devicesto be assembled on the assembly substrate


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