The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2024

Filed:

Nov. 22, 2022
Applicant:

Mediatek Singapore Pte. Ltd., Singapore, SG;

Inventors:

Zhigang Duan, Singapore, SG;

Jinghao Chen, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/522 (2006.01); H01L 25/065 (2023.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/5222 (2013.01); H01L 28/60 (2013.01);
Abstract

A semiconductor structure includes a first substrate having a wiring structure, a first semiconductor die disposed on the first substrate, and a multi-terminal capacitor structure disposed on the first substrate. The multi-terminal capacitor includes a second substrate, an insulating layer disposed over the second substrate, a first multi-terminal capacitor disposed over the insulating layer and electrically coupled to the first semiconductor die through the wiring structure, and a second multi-terminal capacitor disposed over the insulating layer and electrically coupled to the second semiconductor die through the wiring structure, wherein the first multi-terminal capacitor and the second multi-terminal capacitor are electrically isolated from the second substrate.


Find Patent Forward Citations

Loading…